| dc.contributor.author | Bowen, Andrew | en_US |
| dc.contributor.author | Guditz, E. A. | en_US |
| dc.date.accessioned | 2009-06-12T22:13:23Z | |
| dc.date.available | 2009-06-12T22:13:23Z | |
| dc.date.issued | 1954-08-27 | en_US |
| dc.identifier | MC665_r13_M-3005 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1721.3/40341 | |
| dc.description.abstract | The possible eventual breakdown of the Quadruple Formex insulation in memory planes due to the abrasive action of vibrating memory cores could be prevented by wiring the planes with Bondeze #3 Magnetic wire. The resulting plane would have the windings bonded together, forming a strong grid with the memory cores firmly cemented at the intersections of the wires. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | Lincoln Laboratory - Division 6 | en_US |
| dc.relation.ispartofseries | MIT DIC 6889 | en_US |
| dc.relation.ispartofseries | Project Whirlwind Memo M-3005 | en_US |
| dc.relation.ispartofseries | Project Whirlwind Collection, MC665 | en_US |
| dc.title | Bondeze Magnetic Wire for Memory-Plane Construction | en_US |
| dc.type | Technical Report | en_US |
