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dc.contributor.authorGuditz, E. A.en_US
dc.date.accessioned2009-05-08T05:13:38Z
dc.date.available2009-05-08T05:13:38Z
dc.date.issued1953-04-06en_US
dc.identifierMC665_r05_M-1957.pdfen_US
dc.identifier.urihttp://hdl.handle.net/1721.3/39175
dc.description.abstractThe stripping of formex insulated wires used in memory plane construction has been greatly speeded up by a method which permits them to be stripped in bundles of 150 wires rather than singly.en_US
dc.language.isoenen_US
dc.publisherMIT Digital Computer Laboratoryen_US
dc.relation.ispartofseriesMIT DIC 6889en_US
dc.relation.ispartofseriesProject Whirlwind Memo M-1957en_US
dc.relation.ispartofseriesProject Whirlwind Collection, MC665en_US
dc.titleProcedure for Preparing and Stripping Wires for MTC Memory Planesen_US
dc.typeTechnical Reporten_US


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